Plastic Flat Package - definition. What is Plastic Flat Package
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%ما هو (من)٪ 1 - تعريف

SURFACE MOUNT INTEGRATED CIRCUIT PACKAGE
Low-profile Quad Flat Package; Thin Quad Flat Pack; Plastic quad flat pack; Plastic quad flat package; Cerquad; QFP; LQFP; TQFP; PQFP; Eqfp; Vqfp; SQFP; BFQFP; CERQUAD; CQFP; EQFP; VQFP; Quad Flat Pack; Quad flat pack; Plastic Quad Flat Pack; Plastic Quad Flat Package; Thin quad flat pack; Thin Quad Flat Package; Thin quad flat package; Thin QFP; Low Profile Quad Flat Package; Low Profile Quad Flat Pack; Low profile quad flat package; Low profile quad flat pack; Low profile QFP; Low-profile quad flat package; Low-profile quad flat pack; Low-profile QFP; Bumpered Quad Flat Package; Bumpered Quad Flat Pack; Bumpered quad flat package; Bumpered quad flat pack; BQFP; Plastic QFP; Quad-flat package; Quad Flat Package; Ceramic quad flat package

PQFP         
Plastic Quad Flat Package (Reference: CPU)
QFP         
Quad Flat Pack
SQFP         
Shrink Quad Flat Package (Reference: CPU)

ويكيبيديا

Quad flat package

A quad flat package (QFP) is a surface-mounted integrated circuit package with "gull wing" leads extending from each of the four sides. Socketing such packages is rare and through-hole mounting is not possible. Versions ranging from 32 to 304 pins with a pitch ranging from 0.4 to 1.0 mm are common. Other special variants include low-profile QFP (LQFP) and thin QFP (TQFP).

The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies. It is often mixed with hole mounted, and sometimes socketed, components on the same printed circuit board (PCB).

A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27 mm (or 1/20 inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). It is commonly used for NOR flash memories and other programmable components.